Display including plurality of wiring layers in bending region

ABSTRACT

A display including a bending region is provided. The display includes a pixel layer including a plurality of pixel and a substrate disposed under the pixel layer and including a first area on which the pixel layer is disposed and a second area extending out of the pixel layer from the first area, at least a partial area of the second area being bendable, wherein the substrate includes: a wiring layer including at least one first wiring electrically connected with at least one pixel of the plurality of pixels and connected from the first area to the second area, and at least one second wiring disposed in the at least partial area and electrically connected with the at least one first wiring in the second area. Further, other embodiments may be possible.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation application of prior application Ser.No. 16/269,981, filed on Feb. 7, 2019, which has issued as U.S. Pat. No.10,978,494 on Apr. 13, 2021 and is based on and claims priority under 35U.S.C. § 119(a) of a Korean patent application number 10-2018-0016140,filed on Feb. 9, 2018, in the Korean Intellectual Property Office, thedisclosure of which is incorporated by reference herein in its entirety.

BACKGROUND 1. Field

The disclosure relates to a display. More particularly, the disclosurerelates to a display including a bending region.

2. Description of Related Art

An electronic device may refer to a device that performs specificfunctions in accordance with programs installed therein, such as anelectronic notepad, a mobile multimedia player, a mobile communicationterminal, a tablet personal computer (PC), a video/sound device, adesktop/laptop computer, and an automobile navigation system, includinghome appliances. For example, electronic devices can output informationstored therein using sound or images. As electronic devices have becomehighly integrated and high-speed and large-capacity wirelesscommunication has become popular, recently it has become possible tointegrate various functions into a single electronic device.

Portable electronic devices include a window and users can see imagesdisplayed on the display in the electronic devices through the windowfrom the outside. The window may include a transparent area and a bezelarea (e.g., a dead space) surrounding the transparent area. The bezelarea is opaque, so it can hide wiring and components under the bezelarea.

Portable electronic devices may be formed such that the transparent areaof a window is large and the bezel area (e.g., dead space) is small soas to achieve a large screen. The bezel area, which is an area forarranging wiring connected to electrodes of a display or a touch panelin the electronic device, can hide the wiring and provide a gap that canmitigate electromagnetic interference among the wires. For example, thelarger the bezel area, the larger the gaps between the wiring may be,that is, electromagnetic interference can be mitigated, or signals canbe stably transmitted by sufficiently securing line width of thewirings. However, as the bezel area is increased, the area in whichimages can be output may be reduced.

The above information is presented as background information only toassist with an understanding of the disclosure. No determination hasbeen made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the disclosure.

SUMMARY

Wiring connected to a display or a touch panel may be arrangedsubstantially on a substrate (e.g., a flexible printed circuit board)and may be connected to a driving circuit (e.g., a display driverintegrated circuit (IC) (display driver integration (DDI))) or a touchsensor driver IC (T-IC) for driving the display or the touch panel. Thissubstrate may be disposed substantially to correspond to a bezel areaand may be bent in a curved line shape or a curved surface shape toincrease the ratio of the screen area or reduce the bezel area.

As the substrate is bent, the driving circuit can be disposed under thedisplay, so the bezel area can be decreased. According to the substrate,the bending portion of the substrate formed in a curved line shape or acurved surface shape may be damaged by external force, so a crack may begenerated in the wiring. Cracks may even be generated in the wiring bydirect contact or friction between a window and the bending portion.

Aspects of the disclosure are to address at least the above-mentionedproblems and/or disadvantages and to provide at least the advantagesdescribed below. Accordingly, an aspect of the disclosure is to providea display in which a first wiring and a second wiring can be doublyconfigured in a bending region of a substrate.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

In accordance with an aspect of the disclosure, a display is provided.The display includes a pixel layer including a plurality of pixels, asubstrate disposed under the pixel layer and including a first area onwhich the pixel layer is disposed, and a second area extending out ofthe pixel layer from the first area, at least a partial area of thesecond area being bendable, wherein the substrate includes: a wiringlayer including at least one first wiring electrically connected with atleast one pixel of the plurality of pixels, and disposed from the firstarea to the second area, and at least one second wiring disposed in theat least partial area and electrically connected with the at least onefirst wiring in the second area.

In accordance with another aspect of the disclosure, a display isprovided. The display includes a display panel including a first area(e.g., an active area (AA)) including a plurality of pixels, and asecond area including a bendable bending region, at least one firstwiring electrically connected with at least one pixel of the pluralityof pixels, and disposed on the first area and the bending region of thesecond area, and at least one second wiring electrically connected withthe at least one first wiring in the second area, and disposed on thebending region of the second area.

In accordance with another aspect of the disclosure, a display isprovided. The display includes a pixel layer including a plurality ofpixel, and a substrate disposed under the pixel layer, including a firstarea in which the pixel layer is disposed, and a second area extendingout of the pixel layer from the first area, and at least a partial areaof the second area being bendable, wherein the substrate includes: atleast one first wiring electrically connected with first pixels of theplurality of pixels, and disposed from the first area to the secondarea, and at least one second wiring electrically connected with secondpixels different from first pixels electrically connected with the firstwiring, and disposed from the first area to the second area.

In accordance with another aspect of the disclosure, a display isprovided. The display includes a substrate including a first area and asecond area extending from the first area, at least a partial area ofthe second area being bendable, at least one first wiring disposed fromthe first area to the second area, at least one second wiring disposedin the at least a partial area of the second area, and electricallyconnected with the at least one first wiring in the second area, and atleast one wiring layer disposed between the at least one first wiring,and the at least one second wiring and separating the at least one firstwiring and the at least one second wiring.

In accordance with another aspect of the disclosure, a display isprovided. The display includes a substrate including a first area, asecond area extending from a first side of the first area, and a thirdarea extending from a second side of the first area, at least a partialarea of the second area being bendable, and at least a partial area ofthe third area being bendable, at least one first wiring disposed fromthe first side of the first area to the second area, at least one secondwiring disposed in the at least a partial area of the second area, andelectrically connected with the at least one first wiring in the secondarea, at least one third wiring disposed from the second side of thefirst area to the third area, and at least one fourth wiring disposed inthe at least a partial area of the third area, and electricallyconnected with the at least third wiring in the third area.

According to various embodiments, since a first wiring and a secondwiring are doubly separated in a bending region of a substrate, it ispossible to mitigate interference between a window of an electronicdevice and the bending region. Further, two wirings that are arranged inparallel in the related art can be disposed to substantially overlapeach other on different layers in various embodiments, so the width ofthe bending region can be reduced.

According to various embodiments, since a first wiring and a secondwiring are doubly disposed in a bending region of a substrate, the samewiring can be doubly achieved. Accordingly, even if a crack is generatedin at least one of the first wiring and the second wiring, the otherwiring can be electrically connected with the display driver integrationof an electronic device, so a poor wiring rate of a product can bereduced.

Other aspects, advantages, and salient features of the disclosure willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses various embodiments of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the disclosure will be more apparent from the followingdescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a schematic diagram showing an electronic device in a networkenvironment, the electronic device including a plurality of wiringlayers on a bending region according to an embodiment of the disclosure;

FIG. 2A is a front view showing an electronic device according to anembodiment of the disclosure;

FIG. 2B is a rear view showing the electronic device according to anembodiment of the disclosure;

FIG. 2C is an exploded perspective view showing the electronic deviceaccording to an embodiment of the disclosure;

FIG. 3A is a cross-sectional view according to one of variousembodiments and taken along line A-A′ of FIG. 2A according to anembodiment of the disclosure;

FIG. 3B is an enlarged plan view showing the portion A in FIG. 3Aaccording to an embodiment of the disclosure;

FIG. 3C is a cross-sectional view showing a display including a thinfilm transistor (TFT) layer according to one of various embodiments andtaken along line A-A′ of FIG. 2A according to an embodiment of thedisclosure;

FIG. 4 is a plan view showing a display according to an embodiment ofthe disclosure;

FIG. 5 is a lateral cross-sectional view showing a state before adisplay according to other various embodiments is bent according to anembodiment of the disclosure;

FIG. 6 is a lateral cross-sectional view showing a state before a TFTlayer according to other various embodiments is bent according to anembodiment of the disclosure;

FIG. 7 is a lateral cross-sectional view showing another embodiment of awiring layer of a display according to an embodiment of the disclosure;

FIG. 8 is a lateral cross-sectional view showing a display according toan embodiment of the disclosure;

FIG. 9 is a lateral cross-sectional view showing a display according toan embodiment of the disclosure;

FIG. 10 is a front view showing the pattern of a second wiring of adisplay according to an embodiment of the disclosure; and

FIG. 11 is a front view showing another embodiment of the pattern of thesecond wiring of the display according to an embodiment of thedisclosure.

Throughout the drawings, it should be noted that like reference numbersare used to depict the same or similar elements, features, andstructures.

DETAILED DESCRIPTION

The following description with reference to the accompanying drawings isprovided to assist in a comprehensive understanding of variousembodiments of the disclosure as defined by the claims and theirequivalents. It includes various specific details to assist in thatunderstanding but these are to be regarded as merely exemplary.Accordingly, those of ordinary skill in the art will recognize thatvarious changes and modifications of the various embodiments describedherein can be made without departing from the scope and spirit of thedisclosure. In addition, descriptions of well-known functions andconstructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but, are merely used by theinventor to enable a clear and consistent understanding of thedisclosure. Accordingly, it should be apparent to those skilled in theart that the following description of various embodiments of thedisclosure is provided for illustration purpose only and not for thepurpose of limiting the disclosure as defined by the appended claims andtheir equivalents.

It is to be understood that the singular forms “a,” “an,” and “the”include plural referents unless the context clearly dictates otherwise.Thus, for example, reference to “a component surface” includes referenceto one or more of such surfaces.

The electronic device according to various embodiments may be one ofvarious types of electronic devices. The electronic devices may include,for example, a portable communication device (e.g., a smart phone), acomputer device, a portable multimedia device, a portable medicaldevice, a camera, a wearable device, or a home appliance. According toan embodiment of the disclosure, the electronic devices are not limitedto those described above.

It should be appreciated that various embodiments of the disclosure andthe terms used therein are not intended to limit the technologicalfeatures set forth herein to particular embodiments and include variouschanges, equivalents, or replacements for a corresponding embodiment.With regard to the description of the drawings, similar referencenumerals may be used to refer to similar or related elements. It is tobe understood that a singular form of a noun corresponding to an itemmay include one or more of the things, unless the relevant contextclearly indicates otherwise. As used herein, each of such phrases as “Aor B,” “at least one of A and B,” “at least one of A or B,” “A, B, orC,” “at least one of A, B, and C,” and “at least one of A, B, or C,” mayinclude all possible combinations of the items enumerated together in acorresponding one of the phrases. As used herein, such terms as “1st”and “2nd,” or “first” and “second” may be used to simply distinguish acorresponding component from another, and does not limit the componentsin other aspect (e.g., importance or order). It is to be understood thatif an element (e.g., a first element) is referred to, with or withoutthe term “operatively” or “communicatively”, as “coupled with,” “coupledto,” “connected with,” or “connected to” another element (e.g., a secondelement), it means that the element may be coupled with the otherelement directly (e.g., wiredly), wirelessly, or via a third element.

As used herein, the term “module” may include a unit implemented inhardware, software, or firmware, and may interchangeably be used withother terms, for example, “logic,” “logic block,” “part,” or“circuitry”. A module may be a single integral component, or a minimumunit or part thereof, adapted to perform one or more functions. Forexample, according to an embodiment, the module may be implemented in aform of an application-specific integrated circuit (ASIC).

Various embodiments as set forth herein may be implemented as software(e.g., the program 140) including one or more instructions that arestored in a storage medium (e.g., internal memory 136 or external memory138) that is readable by a machine (e.g., the electronic device 101).For example, a processor (e.g., the processor 120) of the machine (e.g.,the electronic device 101) may invoke at least one of the one or moreinstructions stored in the storage medium, and execute it, with orwithout using one or more other components under the control of theprocessor. This allows the machine to be operated to perform at leastone function according to the at least one instruction invoked. The oneor more instructions may include a code generated by a complier or acode executable by an interpreter. The machine-readable storage mediummay be provided in the form of a non-transitory storage medium. Wherein,the term “non-transitory” simply means that the storage medium is atangible device, and does not include a signal (e.g., an electromagneticwave), but this term does not differentiate between where data issemi-permanently stored in the storage medium and where the data istemporarily stored in the storage medium.

According to an embodiment, a method according to various embodiments ofthe disclosure may be included and provided in a computer programproduct. The computer program product may be traded as a product betweena seller and a buyer. The computer program product may be distributed inthe form of a machine-readable storage medium (e.g., compact disc readonly memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded)online via an application store (e.g., Play Store™), or between two userdevices (e.g., smart phones) directly. If distributed online, at leastpart of the computer program product may be temporarily generated or atleast temporarily stored in the machine-readable storage medium, such asmemory of the manufacturer's server, a server of the application store,or a relay server.

According to various embodiments, each component (e.g., a module or aprogram) of the above-described components may include a single entityor multiple entities. According to various embodiments, one or more ofthe above-described components may be omitted, or one or more othercomponents may be added. Alternatively or additionally, a plurality ofcomponents (e.g., modules or programs) may be integrated into a singlecomponent. In such a case, according to various embodiments, theintegrated component may still perform one or more functions of each ofthe plurality of components in the same or similar manner as they areperformed by a corresponding one of the plurality of components beforethe integration. According to various embodiments, operations performedby the module, the program, or another component may be carried outsequentially, in parallel, repeatedly, or heuristically, or one or moreof the operations may be executed in a different order or omitted, orone or more other operations may be added.

FIG. 1 is a block diagram illustrating an electronic device 101 in anetwork environment 100 according to various embodiments according to anembodiment of the disclosure.

Referring to FIG. 1 , the electronic device 101 in the networkenvironment 100 may communicate with an electronic device 102 via afirst network 198 (e.g., a short-range wireless communication network),or an electronic device 104 or a server 108 via a second network 199(e.g., a long-range wireless communication network). According to anembodiment, the electronic device 101 may communicate with theelectronic device 104 via the server 108. According to an embodiment,the electronic device 101 may include a processor 120, memory 130, aninput device 150, a sound output device 155, a display device 160, anaudio module 170, a sensor module 176, an interface 177, a haptic module179, a camera module 180, a power management module 188, a battery 189,a communication module 190, a subscriber identification module (SIM)196, or an antenna module 197. In some embodiments, at least one (e.g.,the display device 160 or the camera module 180) of the components maybe omitted from the electronic device 101, or one or more othercomponents may be added in the electronic device 101. In someembodiments, some of the components may be implemented as singleintegrated circuitry. For example, the sensor module 176 (e.g., afingerprint sensor, an iris sensor, or an illuminance sensor) may beimplemented as embedded in the display device 160 (e.g., a display).

The processor 120 may execute, for example, software (e.g., a program140) to control at least one other component (e.g., a hardware orsoftware component) of the electronic device 101 coupled with theprocessor 120, and may perform various data processing or computation.According to an embodiment, as at least part of the data processing orcomputation, the processor 120 may load a command or data received fromanother component (e.g., the sensor module 176 or the communicationmodule 190) in volatile memory 132, process the command or the datastored in the volatile memory 132, and store resulting data innon-volatile memory 134. According to an embodiment, the processor 120may include a main processor 121 (e.g., a central processing unit (CPU)or an application processor (AP)), and an auxiliary processor 123 (e.g.,a graphics processing unit (GPU), an image signal processor (ISP), asensor hub processor, or a communication processor (CP)) that isoperable independently from, or in conjunction with, the main processor121. Additionally or alternatively, the auxiliary processor 123 may beadapted to consume less power than the main processor 121, or to bespecific to a specified function. The auxiliary processor 123 may beimplemented as separate from, or as part of the main processor 121.

The auxiliary processor 123 may control at least some of functions orstates related to at least one component (e.g., the display device 160,the sensor module 176, or the communication module 190) among thecomponents of the electronic device 101, instead of the main processor121 while the main processor 121 is in an inactive (e.g., sleep) state,or together with the main processor 121 while the main processor 121 isin an active state (e.g., executing an application). According to anembodiment, the auxiliary processor 123 (e.g., an ISP or a communicationprocessor) may be implemented as part of another component (e.g., thecamera module 180 or the communication module 190) functionally relatedto the auxiliary processor 123.

The memory 130 may store various data used by at least one component(e.g., the processor 120 or the sensor module 176) of the electronicdevice 101. The various data may include, for example, software (e.g.,the program 140) and input data or output data for a command relatedthereto. The memory 130 may include the volatile memory 132 or thenon-volatile memory 134.

The program 140 may be stored in the memory 130 as software, and mayinclude, for example, an operating system (OS) 142, middleware 144, oran application 146.

The input device 150 may receive a command or data to be used by anothercomponent (e.g., the processor 120) of the electronic device 101, fromthe outside (e.g., a user) of the electronic device 101. The inputdevice 150 may include, for example, a microphone, a mouse, a keyboard,or a digital pen (e.g., a stylus pen).

The sound output device 155 may output sound signals to the outside ofthe electronic device 101. The sound output device 155 may include, forexample, a speaker or a receiver. The speaker may be used for generalpurposes, such as playing multimedia or playing record, and the receivermay be used for an incoming call. According to an embodiment, thereceiver may be implemented as separate from, or as part of the speaker.

The display device 160 may visually provide information to the outside(e.g., a user) of the electronic device 101. The display device 160 mayinclude, for example, a display, a hologram device, or a projector andcontrol circuitry to control a corresponding one of the display,hologram device, and projector. According to an embodiment, the displaydevice 160 may include touch circuitry adapted to detect a touch, orsensor circuitry (e.g., a pressure sensor) adapted to measure theintensity of force incurred by the touch.

The audio module 170 may convert a sound into an electrical signal andvice versa. According to an embodiment, the audio module 170 may obtainthe sound via the input device 150, or output the sound via the soundoutput device 155 or a headphone of an external electronic device (e.g.,an electronic device 102) directly (e.g., wiredly) or wirelessly coupledwith the electronic device 101.

The sensor module 176 may detect an operational state (e.g., power ortemperature) of the electronic device 101 or an environmental state(e.g., a state of a user) external to the electronic device 101, andthen generate an electrical signal or data value corresponding to thedetected state. According to an embodiment, the sensor module 176 mayinclude, for example, a gesture sensor, a gyro sensor, an atmosphericpressure sensor, a magnetic sensor, an acceleration sensor, a gripsensor, a proximity sensor, a color sensor, an infrared (IR) sensor, abiometric sensor, a temperature sensor, a humidity sensor, or anilluminance sensor.

The interface 177 may support one or more specified protocols to be usedfor the electronic device 101 to be coupled with the external electronicdevice (e.g., the electronic device 102) directly (e.g., wiredly) orwirelessly. According to an embodiment, the interface 177 may include,for example, a high definition multimedia interface (HDMI), a universalserial bus (USB) interface, a secure digital (SD) card interface, or anaudio interface.

A connecting terminal 178 may include a connector via which theelectronic device 101 may be physically connected with the externalelectronic device (e.g., the electronic device 102). According to anembodiment, the connecting terminal 178 may include, for example, a HDMIconnector, a USB connector, a SD card connector, or an audio connector(e.g., a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanicalstimulus (e.g., a vibration or a movement) or electrical stimulus whichmay be recognized by a user via his tactile sensation or kinestheticsensation. According to an embodiment, the haptic module 179 mayinclude, for example, a motor, a piezoelectric element, or an electricstimulator.

The camera module 180 may capture a still image or moving images.According to an embodiment, the camera module 180 may include one ormore lenses, image sensors, ISP, or flashes.

The power management module 188 may manage power supplied to theelectronic device 101. According to an embodiment, the power managementmodule 188 may be implemented as at least part of, for example, a powermanagement integrated circuit (PMIC).

The battery 189 may supply power to at least one component of theelectronic device 101. According to an embodiment, the battery 189 mayinclude, for example, a primary cell which is not rechargeable, asecondary cell which is rechargeable, or a fuel cell.

The communication module 190 may support establishing a direct (e.g.,wired) communication channel or a wireless communication channel betweenthe electronic device 101 and the external electronic device (e.g., theelectronic device 102, the electronic device 104, or the server 108) andperforming communication via the established communication channel. Thecommunication module 190 may include one or more communicationprocessors that are operable independently from the processor 120 (e.g.,the AP) and supports a direct (e.g., wired) communication or a wirelesscommunication. According to an embodiment, the communication module 190may include a wireless communication module 192 (e.g., a cellularcommunication module, a short-range wireless communication module, or aglobal navigation satellite system (GNSS) communication module) or awired communication module 194 (e.g., a local area network (LAN)communication module or a power line communication (PLC) module). Acorresponding one of these communication modules may communicate withthe external electronic device via the first network 198 (e.g., ashort-range communication network, such as Bluetooth™, wireless-fidelity(Wi-Fi) direct, or infrared data association (IrDA)) or the secondnetwork 199 (e.g., a long-range communication network, such as acellular network, the Internet, or a computer network (e.g., LAN or widearea network (WAN)). These various types of communication modules may beimplemented as a single component (e.g., a single chip), or may beimplemented as multi components (e.g., multi chips) separate from eachother. The wireless communication module 192 may identify andauthenticate the electronic device 101 in a communication network, suchas the first network 198 or the second network 199, using subscriberinformation (e.g., international mobile subscriber identity (IMSI))stored in the subscriber identification module 196.

The antenna module 197 may transmit or receive a signal or power to orfrom the outside (e.g., the external electronic device) of theelectronic device 101. According to an embodiment, the antenna module197 may include an antenna including a radiating element composed of aconductive material or a conductive pattern formed in or on a substrate(e.g., printed circuit board (PCB)). According to an embodiment, theantenna module 197 may include a plurality of antennas. In such a case,at least one antenna appropriate for a communication scheme used in thecommunication network, such as the first network 198 or the secondnetwork 199, may be selected, for example, by the communication module190 (e.g., the wireless communication module 192) from the plurality ofantennas. The signal or the power may then be transmitted or receivedbetween the communication module 190 and the external electronic devicevia the selected at least one antenna. According to an embodiment,another component (e.g., a radio frequency integrated circuit (RFIC))other than the radiating element may be additionally formed as part ofthe antenna module 197.

At least some of the above-described components may be coupled mutuallyand communicate signals (e.g., commands or data) therebetween via aninter-peripheral communication scheme (e.g., a bus, general purposeinput and output (GPIO), serial peripheral interface (SPI), or mobileindustry processor interface (MIPI)).

According to an embodiment, commands or data may be transmitted orreceived between the electronic device 101 and the external electronicdevice 104 via the server 108 coupled with the second network 199. Eachof the electronic devices 102 and 104 may be a device of a same type as,or a different type, from the electronic device 101. According to anembodiment, all or some of operations to be executed at the electronicdevice 101 may be executed at one or more of the external electronicdevices 102, 104, or 108. For example, if the electronic device 101should perform a function or a service automatically, or in response toa request from a user or another device, the electronic device 101,instead of, or in addition to, executing the function or the service,may request the one or more external electronic devices to perform atleast part of the function or the service. The one or more externalelectronic devices receiving the request may perform the at least partof the function or the service requested, or an additional function oran additional service related to the request, and transfer an outcome ofthe performing to the electronic device 101. The electronic device 101may provide the outcome, with or without further processing of theoutcome, as at least part of a reply to the request. To that end, acloud computing, distributed computing, or client-server computingtechnology may be used, for example.

FIG. 2A is a perspective view showing the front surface of an electronicdevice (e.g., an electronic device 101 shown in FIG. 1 ) according to anembodiment of the disclosure.

FIG. 2B is a perspective view showing the rear surface of the electronicdevice shown in FIG. 2A according to an embodiment of the disclosure.

FIG. 2C is an expanded perspective view of the electronic device shownin FIG. 2A according to an embodiment of the disclosure.

Referring to FIGS. 2A and 2B, an electronic device 200 according to anembodiment may include a housing 210 having a first surface (or a frontsurface) 210A, a second surface (or a rear surface) 210B, and a side210C surrounding the space between the first surface 210A and the secondsurface 210B. In another embodiment (not shown), the housing may referto a structure forming some of the first surface 210A, the secondsurface 210B, and the side 210C shown in FIG. 2A. According to anembodiment, the first surface 210A may be at least partiallysubstantially formed by a transparent front plate 202 (e.g., a glassplate or a polymer plate including various coating layers). The secondsurface 210B may be formed by a substantially opaque rear plate 211. Therear plate 211, for example, may be made of coated or colored glass,ceramic, a polymer, metal (e.g., aluminum, stainless steel (STS), ormagnesium), or a combination thereof. The side 210C is combined with afront plate 202 and a rear plate 211 and may be formed by a lateralbezel structure 218 (or a “lateral member”) including metal and/or apolymer. In an embodiment, the rear plate 211 and the lateral bezelstructure 218 may be integrated and may include the same material (e.g.,a metallic material such as aluminum).

According to an embodiment, the electronic device 200 may include atleast one or more of a display 201, a microphone hole 203 and/or speakerholes 207 and 214, sensor modules 204 and 219, camera modules 205, 212,and 213, key input units 215, 216, and 217, an indicator 206, andconnector holes 208 and 209. In an embodiment, the electronic device 200may not include at least one (e.g., the key input units 215, 216, and217 or the indicator 206) of the components or may further include othercomponents.

The display 201, for example, may be exposed through a large part of thefront plate 202. The display 201 may be combined with or disposedadjacent to a touch sensing circuit, a pressure sensor that can measurethe intensity (pressure) of a touch, and/or a digitizer that detects amagnetic stylus pen.

A microphone for catching external sounds may be disposed in themicrophone hole 203, and in an embodiment, a plurality of microphonesmay be disposed therein to sense the direction of sounds. The speakerholes 207 and 214 may include an external speaker hole 207 and/or areceiver hole 214 for a telephone call. In an embodiment, the speakerholes 207 and 214 and the microphone hole 203 may be integrated into onehole or a speaker (e.g., 305 in FIGS. 3A through 3C) may be includedwithout the speaker holes 207 and 214.

The sensor modules 204 and 219 can generate electrical signals or datavalues corresponding to the internal operation state of the electronicdevice 200 or the external environmental state. The sensor modules 204and 219, for example, may include a first sensor module 204 (e.g., aproximity sensor) disposed on the first surface 210A of the housing 210,a second sensor module (not shown) (e.g., a fingerprint sensor), and/ora third sensor module 219 (e.g., a heart rate monitor (HRM) sensor)disposed on the second surface 210B of the housing 210. The fingerprintsensor may be disposed not only on the first surface 210A (e.g., a homekey button 215), but also on the second surface 210B of the housing 210.The electronic device 200 may further include, for example, at least oneof a gesture sensor, a gyro sensor, a barometer sensor, a magneticsensor, an acceleration sensor, a grip sensor, a color sensor, an IRsensor, a biosensor, a temperature sensor, a humidity sensor, and anillumination sensor, which are not shown in the figures.

The camera modules 205, 212, and 213 may include a first camera module205 disposed on the first surface 210A of the housing of the electronicdevice 200, and a second camera 212 and/or a flash 213 disposed on thesecond surface 210B. The camera modules 205 and 212 may include one ormore lenses, an image sensor, and/or an ISP. The flash 213, for example,may include a light emitting diode or a xenon lamp. In an embodiment,two or more lenses (a wide-angle lens and a telephoto lens) and imagesensors may be disposed on one surface of the electronic device 200.

The key input units 215, 216, and 217 may include a home key button 215disposed on the first surface 210A of the housing 210, touch pads 216disposed around the home key button 215, and/or a side key button 217disposed on the side 210C of the housing 210. In another embodiment, theelectronic device 200 may not include some or all of the key input units215, 216, and 217 described above and the not-included key input units215, 216, and 217 may be implemented in other types such as a softwarekey on the display 201.

The indicator 206, for example, may be disposed on the first surface210A of the housing 210. The indicator 206, for example, can providestate information of the electronic device 200 using an optical type andmay include an LED.

The connector holes 208 and 209 may include a first connector hole 208that can accommodate a connector (e.g., a USB connector) fortransmitting and receiving power and/or data to and from externalelectronic devices and/or a second connector hole 209 (e.g., an earphonejack) that can accommodate a connector for transmitting and receivingaudio signals to and from external electronic devices.

Referring to FIG. 2C, the electronic device 200 may include a lateralbezel structure 218, an intermediate plate 280 (e.g., a bracket), afront plate 202, a display 201, a printed circuit board 240, a battery250, a supporting member 260 (e.g., a rear case), an antenna 270, and arear plate 211. In an embodiment, the electronic device 200 may notinclude at least one (e.g., the intermediate plate 280 or the supportingmember 260) of the components or may further include other components.At least one of the components of the electronic device 200 may be thesame as or similar to at least one of the components of the electronicdevice 200 shown in FIG. 2A or FIG. 2B and a repeated description isomitted below.

The intermediate plate 280 is disposed in the electronic device 200 andmay be connected with the lateral bezel structure 218 or may beintegrated with the lateral bezel structure 218. The intermediate plate280, for example, may be made of a metallic material and/or anon-metallic material (e.g., a polymer). The display 201 may be coupledto a surface of the intermediate plate 280 and the printed circuit board240 may be coupled to the other surface of the intermediate plate 280. Aprocessor, a memory, and/or an interface may be mounted on the printedcircuit board 240. The processor, for example, may include one or moreof a CPU, an AP, a graphic processor, an ISP, a sensor hub processor,and a communication processor.

The memory, for example, may include a volatile memory or a nonvolatilememory.

The interface may include a HDMI, a USB interface, an SD card interface,and/or an audio interface. The interface, for example, can electricallyor physically connect the electronic device 200 to external electronicdevices and may include an USB connector, an SD card/MMC connector, oran audio connector.

The battery 250, which is a device for supplying power to one or morecomponents of the electronic device 200, for example, may include aprimary battery that is not rechargeable, a secondary battery that isrechargeable, or a fuel cell. At least a portion of the battery 250, forexample, may be disposed in substantially the same plane as the printedcircuit board 240. The battery 250 may be integrally disposed in theelectronic device 200 and may be detachably attached to the electronicdevice 200.

The antenna 270 may be disposed between the rear plate 211 and thebattery 250. The antenna 270, for example, may include a near fieldcommunication (NFC) antenna, a wireless charging antenna, and/or amagnetic secure transmission (MST) antenna. The antenna 270, forexample, can perform near field communication with external devices orcan wirelessly transmit and receive power for charging. In anotherembodiment, the antenna may be formed by a portion or a combination ofthe lateral bezel structure 218 and/or the supporting member 260.

FIG. 3A is a cross-sectional view according one of various embodimentstaken along line A-A′ shown in FIG. 2A according to an embodiment of thedisclosure.

FIG. 3B is an enlarged plan view of the portion A shown in FIG. 3Aaccording to an embodiment of the disclosure.

Referring to FIGS. 3A and 3B, a display 300, according to one of variousembodiments, may include a display panel 301 and a touch sensor 302. Thedisplay panel 301 may include a substrate 310. For example, the displaypanel 301 may include an organic light emitting diode (OLED) element.

The substrate 310 may include any one or two or more combinationsselected from polycarbonate (PC), polymethyl methacrylate (PMMA),polyimide (PI), polyethylene terephthalate (PET), polypropyleneterephthalate (PPT), amorphous polyethylene terephthalate (APET),polyethylene naphthalate terephthalate (PEN), polyethylene terephthalateglycol (PETG), tri-acetyl-cellulose (TAC), cyclic olefin polymer (COP),cyclic olefin copolymer (COC), polydicyclopentadiene (DCPD),cyclopentdienyl anions (CPD), polyarylate (PAR), polyethersulfone (PES),poly ether imide (PEI), and modified epoxy resin or acrylic resinAccording to an embodiment, the substrate 310 may be made of aninflexible material.

The display panel 301 may be disposed under the touch sensor 302. Thedisplay panel 301 is not limited to an OLED and may be various displaydevices such as an LCD.

A display driver 380 (e.g., a display driver integration (DDI) may be adisplay driving chip that controls a plurality of pixels 351, 352, 353of the display 300 to provide various colors.

According to an embodiment, the display driver 380 may be disposed atleast one of an end of the display panel 301 and a circuit board (e.g.,an M-FPCB) (not shown) included in an electronic device (e.g., 200 inFIG. 2A). The display driver 380 will be described hereafter based on anembodiment in which the display driver 380 is disposed at an end of thedisplay panel 301.

The substrate 310 may be disposed under a pixel layer 350 including theplurality of pixels 351, 352, and 353.

The plurality of pixels 351, 352, and 353 can generate light foroutputting images. The plurality of pixels 351, 352, and 353 may bearranged on a first insulating layer 341 of a wiring layer 340.

The substrate 310 includes a first area 311 on which the pixel layer 350is disposed and a second area 312 extending out of the pixel layer 350from the first area 311. At least a partial area of the second area 312may be bendable.

The substrate 310 may include at least one first wiring 320, at leastone second wiring 330, or a wiring layer 340.

The at least one first wiring 320 may be electrically connected with theplurality of pixels 351, 352 and 353 and may be disposed from the firstarea 311 to the second area 312.

The at least one second wiring 330 may be disposed on at least a partialarea of the second area 312 and may be electrically connected with theat least one first wiring 320 in the second area 312.

The wiring layer 340 may be disposed between the at least one firstwiring 320 and the at least one second wiring 330 to be able to separatethe at least one first wiring 320 from the at least one second wiring330. For example, as shown in FIG. 3A, the first wiring 320 may bedisposed on the bottom surface of a first insulating layer 341 and asecond insulating layer 342, and the second wiring 330 may be disposedon the top surface of the second insulating layer 342.

According to an embodiment, the substrate 310 may include first andsecond substrates 310 a and 310 b. The first substrate 310 a may bedisposed in the first area 311, the second substrate 310 b may be bentat a side of the first area 311 such that a portion of the secondsubstrate 310 b (e.g., the portion on which the display driver 380 ismounted) is disposed on the rear surface of the first substrate 310 a.The first substrate 310 a may be disposed under a plurality of pixels351, 352 and 353. The second substrate 310 b may be bent in at least apartial area of the second area 312. For example, the second substrate310 b may extend and bend from the first substrate 310 a.

The at least one first wiring 320 may be disposed on the first andsecond areas 311 and 312. The at least one first wiring 320 electricallyconnected with the plurality of pixels 351, 352 and 353. The least onesecond wiring 330 electrically connected with the at least one firstwiring 320 may be disposed on at least a partial area of the second area312.

The first wiring 320 and second wiring 330 may be disposed on differentsurfaces of the second insulating layer 342. For example, the firstwiring 320 may be disposed on a first surface of the of the secondinsulating layer 342 and the second wiring 330 may be disposed on asecond surface opposite to the first surface of the second insulatinglayer 342.

The wiring layer 340 may include a first insulating layer 341 and asecond insulating layer 342. The first insulating layer 341 may bedisposed on the first area 311. The second insulating layer 342 may bedisposed on the second area 312. The second insulating layer 342 mayseparate the first wiring 320 and the second wiring 330 in at leastbending regions of the second area 312.

The first insulating layer 341 or the second insulating layer 342 mayinclude at least one of a thin film encapsulation (TFE) layer, a pixeldefine layer (PDL), and a thin film transistor (TFT) Passivation layer.A TFE layer is exemplified but the first insulating layer 341 or thesecond insulating layer 342 are not limited thereto. For example,various configurations may be applied to the first insulating layer 341and the second insulating layer 342 as long as they can provideelectrical insulation.

According to an embodiment, at least a portion of the second substrate310 b may be formed in a chip on plastic (COP) structure, which is abending structure. For example, the COP structure may be formed byfurther extending some plastic layers in the second substrate 310 b,mounting a display driver 380 (e.g., a DDI), and then bending the secondsubstrate 310 b. The second substrate 310 b can provide the area formounting the display driver 380 by extending from the first substrate310 a and is deformed in a curved surface shape, whereby the displaydriver 380 can be disposed on the rear surface of the first substrate310 a. The bent area of the second substrate 310 b may have anelliptical or semicircular cross-section. The display driver 380 forcontrolling the display panel 301 may be disposed at an end of thesecond substrate 310 b. The display driver 380 may be electricallyconnected with the plurality of pixels 351, 352 and 353 disposed on thefirst substrate 310 a through the at least one first wiring 320 and theat least one second wiring 330. For example, in an embodiment, thedisplay driver 380 may be set to output display information bycontrolling the plurality of pixels 351, 352 and 353 disposed on thesubstrate 310.

According to an embodiment, the display 300 may further include at leastone protective film 370. The at least one protective film 370 may beattached to the lower portion of the first substrate 310 a or to an endof the second substrate 310 b.

As described above, since the at least one first wiring 320 is disposedon the first substrate 310 a and the second substrate 310 b, the atleast one first wiring 320 and the at least one second wiring 330 areseparately and doubly disposed in the second area 312 (e.g., a bendingregion) of the second substrate 310 b, it is possible to mitigate aproblem (e.g., insulator cracks or breakage of wire) that may occur dueto interference between the window (not shown) of an electronic device(e.g., 101 in FIG. 1 ) and the second area 312 (e.g., the bendingregion) of the second substrate 310 b, and it is also possible to reducethe width of the second area 312 (e.g., the bending region) of thesecond substrate 310 b.

Referring to FIG. 3A stated above, the first wiring 320 and the secondwiring 330 may be separately disposed on the bottom and the top of thesecond insulating layer 342 on the second area 312 of the secondsubstrate 310 b. According to an embodiment, since the first wiring 320and the second wiring 330 are disposed on the bottom and the top of thesecond insulating layer 342, respectively, the first wiring 320 and thesecond wiring 330 may face each other in the second area 312 with thesecond insulating layer 342 therebetween.

According to an embodiment, a width of at least a portion of the secondwiring 330 may be greater than a width of at least a portion of thefirst wiring 320.

FIG. 3C is a cross-sectional view showing a display including a TFTlayer, according to one of various embodiments, and taken along lineA-A′ of FIG. 2A according to an embodiment of the disclosure.

Referring to FIG. 3C, a display 300, according to one of variousembodiments, may include a display panel 301, a touch sensor 302 and aTFT layer 303, the display panel 301 may include a substrate 310. Forexample, the display panel 301 may include an organic light emittingdiode (OLED) element. At least one of the components of the display 300including the TFT layer 303 may be the same as or similar to at leastone of the components of the display 300 shown in FIG. 3A or FIG. 3B anda repeated description is omitted below.

The display driver 380 (e.g., a DDI) may be a display driving chip thatcontrols the pixels 351, 352 and 353 of the display 300 to generatevarious colors.

The substrate 310 may be disposed under the pixel layer 350 includingthe plurality of pixels 351, 352 and 353 and may include a second area312 extending out of the pixel layer 350 from a first area 311 on whichthe pixel layer 350 is disposed, and at least a partial area of thesecond area 312 may being bendable.

The display 300 may include at least one first wiring 320, at least onesecond wiring 330, and a wiring layer 340.

The at least one first wiring 320 may be electrically connected with theplurality of pixels 351, 352 and 353 and may be disposed from the firstarea 311 to the second area 312.

The at least one second wiring 330 may be disposed on at least a partialarea of the second area 312 and may be electrically connected with theat least one first wiring 320 in the second area 312.

The wiring layer 340 may be disposed between the at least one firstwiring 320 and the at least one second wiring 330 to be able to separatethe at least one first wiring 320 and the at least one second wiring330. For example, as shown in FIG. 3C, the at least one first wiring 320may be disposed on the bottom surface of a first insulating layer 341and a second insulating layer 342 and the at least one second wiring 330may be disposed on the top surface of the second insulating layer 342.

The TFT layer 303 may be disposed between the first and secondinsulating layers 341 and 342 and the substrate 310. At least a portionof the TFT layer 303 may be disposed on the first area 311 and thesecond area 312. The at least one first wiring 320 may be disposed inthe TFT layer 303.

The at least one first wiring 320 may be disposed on the first area 311and the second area 312, the second wiring 330 may be separatelydisposed on the bottom and the top of the second insulating layer 342,respectively, in the second area 312. According to an embodiment, sincethe first wiring 320 and the second wiring 330 are disposed on thebottom and the top of the second insulating layer 342, respectively, theat least one first wiring 320 and the at least one second wiring 330 mayface each other in the second area 312 with the second insulating layer342 therebetween.

According to an embodiment, at least one of the components of the touchsensor 302 shown in FIG. 3C may be the same as or similar to at leastone of the components of the touch sensor 302 shown in FIG. 3A or 3B,and a repeated description is omitted.

FIG. 4 is a plan view showing a display according to an embodiment ofthe disclosure.

Referring to FIG. 4 , a display 400 may include a display panel 401 anda pixel layer including a plurality of pixels 451, 452, 453, 454, 456,457 and 458 (collectively pixels 450). For example, a display panel 401may include a substrate 410, the substrate 410 may include a firstsubstrate 410 a and a second substrate 410 b.

The first substrate 410 a may be disposed under the plurality pixels451, 452, 453, 454, 456, 457 and 458 and the first substrate 410 a maybe disposed on a first area 411. The second substrate 410 b may disposedon a second area 412 extending out of the plurality pixels 451, 452,453, 454, 456, 457 and 458 from a first area 411, and at least a partialarea of the second area 412 may being bendable.

The display panel 401 may include at least one first wiring and at leastone second wiring 430 and a wiring layer (e.g., 340 in FIG. 3A).

The at least one first wiring 420 may be electrically connected with thepixels of the plurality of pixels 451, 452, 453, 454, 456, 457 and 458and may be disposed from the first area 411 to the second area 412.

The at least one second wiring 430 may be disposed on at least a partialarea of the second area 412 and may be electrically connected with theat least one first wiring 420 on the second area 412.

According to an embodiment, at least a portion of the second substrate410 b may be formed in a COP structure, which is a bending structure.For example, the COP structure may be formed by further extending someplastic layers in the second substrate 410 b, mounting a display driver480 (e.g., a DDI), and then bending the second substrate 410 b. Thesecond substrate 410 b can provide the area for mounting the displaydriver 480 by extending from the first substrate 410 a and is deformedin a curved surface shape, whereby the display driver 380 can bedisposed on the rear surface of the first substrate 410 a. The bent areaof the second substrate 410 b may have an elliptical or semicircularcross-section. The display driver 480 for controlling the display panel401 may be disposed at an end of the second substrate 410 b. The displaydriver 480 may be electrically connected with the plurality of pixels451, 452, 453, 454, 456, 457 and 458 disposed on the first substrate 410a through the at least one first wiring 420 and the at least one secondwiring 430. For example, in an embodiment, the display driver 480 may beset to output display information by controlling the plurality of pixels451, 452, 453, 454, 456, 457 and 458 disposed on the substrate 410.

The at least one data line D1, D2 may include a first data line D1 or asecond data line D2. For example, the first data line D1 may beelectrically connected with at least some pixels 451, 453, and 457disposed at odd-numbered positions of the plurality of pixels 451, 452,453, 454, 456, 457 and 458, and the second data line D2 may beelectrically connected with at least some pixels 452, 454, 456 and 458disposed at even-numbered positions of the plurality of pixels 451, 452,453, 454, 456, 457 and 458.

The at least one scan line S1, S2 may include a first scan line S1 or asecond scan line S2. For example, the first scan line S1 may beelectrically connected with at least some odd-numbered pixels 451, 453,and 457 disposed at odd-numbered positions of the plurality of pixels451, 452, 453, 454, 456, 457 and 458 and the second scan line S2 may beelectrically connected with at least some even-numbered pixel layers452, 454, 456 and 458 disposed at even-numbered positions of theplurality of pixels 451, 452, 453, 454, 456, 457 and 458.

The wire layer (e.g., 340 in FIG. 3A) may include a first insulatinglayer (e.g., 341 in FIG. 3A) and a second insulating layer (e.g., 342 inFIG. 3A). The first data line D1, the second data line D2, the firstscan line S1, and the second scan line S2 may dispose under the firstinsulating layer (e.g., 341 in FIG. 3A) The second insulating layer(e.g., 342 in FIG. 3A) may separate the first data line D1 and thesecond data line D2 in at least a bending region of a second area (e.g.,312 in FIG. 3A). Further, the second insulating layer (e.g., 342 in FIG.3A) may separate the first scan line S1 and the second scan line S2 inat least the bending region of the second area (e.g., 312 in FIG. 3A).

According to an embodiment, the data lines, the first data line D1 ofthe at least one data line D1, D2 can be electrically connected with atleast some odd-numbered pixels 451, 453, and 457 disposed atodd-numbered positions of the plurality of pixels 451, 452, 453, 454,456, 457 and 458 and the second data line D2 of the at least one dataline D1, D2 can be electrically connected with at least even-numberedpixels 452, 454, 456 and 458 disposed at even-numbered positions of theplurality of pixels 451, 452, 453, 454, 456, 457 and 458.

According to an embodiment, the scan lines, the first scan line S1 ofthe at least one scan line S1, S2 can be electrically connected with atleast some odd-numbered pixel layers 451, 453, and 457 disposed atodd-numbered positions of the plurality of pixels 451, 452, 453, 454,456, 457 and 458 and the second scan line S2 of the at least one scanline S1, S2 can be electrically connected with at least even-numberedpixels 452, 454, 456 and 458 disposed at even-numbered positions of theplurality of pixels 451, 452, 453, 454, 456, 457 and 458.

For example, the at least one data line D1, D2 and the at least one scanline S1, S2 can separately connect the plurality of pixels 451, 452,453, 454, 456, 457 and 458 in accordance with the arranged positions(e.g., odd-numbered positions or even-numbered positions) withoutconnecting all the plurality of pixels 451, 452, 453, 454, 456, 457 and458 regardless of the arranged positions. Accordingly, it is possible toreduce the at least one data line D1, D2 and the at least one scan lineS1, S2.

FIG. 5 is a lateral cross-sectional view showing a state before adisplay 600 according to other various embodiments is bent according toan embodiment of the disclosure.

Referring to FIG. 5 , the display 600 may include a display panel 601.The display panel 601 may include a substrate 610. A pixel layer 650including a plurality of pixels 650 a. A first area 611, a second area612, a first wiring 620, a second wiring 630, a wiring layer 640, and adisplay driver 680 (e.g., a DDI) may be disposed on the substrate 610.For example, the second wiring 630 may extend from the first wiring 620at a first position, for example, a bending start position of the secondarea 612. The second wiring 630 may be separated from the first wiring620 forming a dual structure between the first position and a secondposition of the second area 612. The second wiring 630 may beelectrically connected back to the first wiring 620 at the secondposition, for example, a bending end position of the second area 612.For example, in the first area 611, the first wiring 620 and the firstinsulating layer 641 are disposed, and, in the second area 612, thefirst wiring 620 and the second wiring 630 may be separated and doublydisposed with the second insulating layer 642 therebetween. Accordingly,even if any one of the first wiring 620 and the second wiring 630 is cutby a crack, electric connection with the display driver 680 can bemaintained through the other wiring, so the display 600 can be operated.Accordingly, it is possible to not only reduce wiring problems of thedisplay 600, but also reduce display malfunctions. The pixel layer 650may be disposed under the first insulating layer 641.

According to an embodiment, the substrate 610 may include a firstsubstrate 610 a and a second substrate 610 b, and the first substrate610 a and the second substrate 610 b can be easily understood throughthe embodiments described above, so they are not described in detail.

The first wiring 620 or the second wiring 630 are doubly disposed in thesecond area 612 (e.g., a bending region) of the second substrate 610 bwhile separated with each other, so it is possible to mitigate a problem(e.g., insulator cracks or breakage of wire) that may occur due tointerference between a window (not shown) of an electronic device (e.g.101 in FIG. 1 ) and the second area 612 (e.g., the bending region) ofthe second substrate 610 b and it is also possible to reduce the widthof the second area 612 (e.g., the bending region) of the secondsubstrate 610 b.

FIG. 6 is a lateral cross-sectional view showing a state before a touchsensor 702, according to an embodiment of the disclosure.

Referring to FIG. 6 , the display may include the touch sensor 702, atleast one first wiring 761, at least one second wiring 762, a wiringlayer 740, or a touch sensor driver IC (T-IC) 781. The touch sensor 702may be electrically connected at least one first wiring 761, at leastone second wiring 762. The at least one first wiring 761 may be disposedin a first area 711 and a second area 712. The at least one secondwiring 762 may be disposed in the second area 712. The second area 712may being bendable.

For example, the at least one second wiring 762 may be separated in anelectrically connected state at a first position of the second area 712,for example, at a bending start position of the second area 712. Thesecond wiring 762 may be separated by a second insulating layer 742,between the first position and a second position of the second area 712,for example, at a bending end position of the second area 712. Thesecond wiring 762 may be electrically connected back to the at least onefirst wiring 761 into one wiring at the second position of the secondarea 712, for example, the bending end position of the second area 712.For example, the wiring layer 740 may include a first insulating layer741 and a second insulating layer 742. The first wiring 761 and thefirst insulating layer 741 may be disposed in the first area 711. Thefirst wiring 761 and the second wiring 762 may be separated by thesecond insulating layer 742 of the wiring layer 740 and doubly disposedin a dual structure in the second area 712. Accordingly, even if thefirst wiring 761, that is, one of the first wiring 761 and the secondwiring 762, for example, the first wiring 761, is cut by a crack, theother wiring, for example, the second wiring 762 can electricallyconnect the T-IC 781 and the touch sensor 702. Accordingly, wiringproblems, such as a disconnection, for the touch sensor 702 can bereduced.

A plurality of electrodes (not shown) included in the touch sensor 702may be disposed on the top of the first insulating layer 741.

As described above, since the at least one first wiring 761 and the atleast one second wiring 762 are separately by the second insulatinglayer 742 and doubly disposed in a dual structure in the second area 712(e.g., a bending region) of the touch sensor 702, it is possible tomitigate a problem (e.g., insulator cracks or breakage of wire) that mayoccur due to interference between a window (not shown) of an electronicdevice (e.g., 101 in FIG. 1 ) and the second area 712 (e.g., the bendingregion) of the touch sensor 702 and it is also possible to reduce thewidth of the second area 712 (e.g., the bending region) of the touchsensor 702.

FIG. 7 is a lateral cross-sectional view showing another embodiment of awiring layer 840 of a display 800 according to an embodiment of thedisclosure.

Referring to FIG. 7 , a display 800, according to one of variousembodiments, may include a display panel 801, a touch sensor 802. Apixel layer 850 including a plurality of pixels 851, 852 and 853. Thedisplay panel 801 may include a substrate 810. The substrate 810 may bedisposed under the pixel layer 850 and may include a first area 811 onwhich the pixel layer 850 is disposed and a second area 812 extendingout of the pixel layer 850 from the first area 811. At least a partialarea of the second area 812 may being bendable. The display 800 mayinclude at least one first wiring 820, at least one second wiring 830,or at least one wiring layer 840. The at least one first wiring 820 maybe electrically connected with the plurality of pixels 851, 852 and 853and may be extended from the first area 811 to the second area 812. Theleast one second wiring 830 electrically connected with the at least onefirst wiring 820 may be disposed on at least a partial area of thesecond area 812.

According to an embodiment, the substrate 810 may include first andsecond substrates 810 a and 810 b. The first substrate 810 a may bedisposed in the first area 311, the second substrate 310 b may be bentat a side of the first area 811 such that a portion of the secondsubstrate 810 b (e.g., the portion on which the display driver 880 ismounted) is disposed on the rear surface of the first substrate 810 a.The first substrate 810 a may be disposed under a plurality of pixels851, 852 and 853. The second substrate 810 b may be bent in at least apartial area of the second area 812. For example, the second substrate810 b may extend and bend from the first substrate 810 a.

According to an embodiment, the display 801 may further include at leastone protective film 870. The at least one protective film 870 may beattached to the lower portion of the first substrate 810 a or to an endof the second substrate 810 b.

The substrate 810, the first area 811, the second area 812, the at leastone first wiring 820, and the at least one second wiring 830 can beeasily understood through the embodiments described above, so a repeateddescription is omitted.

The at least one wiring layer 840 includes a first insulating layer 841and a second insulating layer 842. The pixel layer 850 may be disposedon the first insulating layer 841.

The second insulating layer 842 may be disposed between the at least onefirst wiring 820 and the at least one second wiring 830 to be able toseparate the at least one first wiring 820 and the at least one secondwiring 830.

The second insulating layer 842 may include a wiring extension 831extending from the second area 812 and covering the display driver 880(e.g., a DDI) of the display 800. For example, the second insulatinglayer 842 may include a start position 842 a and an end position 842 b.

The wiring extension 831 can extend from the end position 842 b of thesecond insulating layer 842 and can cover the display driver 880.

The display driver 880 (e.g., a DDI) may generate noise due tointerference with at least one part (e.g., an antenna) of an electronicdevice (e.g., 101 in FIG. 1 ) disposed adjacent to the display driver880, so the operation of the display driver 880 may be hindered.

Accordingly, in an embodiment, the wiring extension 831 covering thedisplay driver 880 (e.g., a DDI) is configured to mitigate noise, so itis possible to not only mitigate noise due to interference with the atleast one part (e.g., an antenna) when an electronic device (101 in FIG.1 ) operates, but also improve the performance and strength of thedisplay driver 880 (e.g., a DDI).

According to an embodiment, the wiring extension 831 may include aground layer to increase the effect of mitigating noise due to the atleast one part (e.g., an antenna).

FIG. 8 is a lateral cross-sectional view showing a display 900 accordingto an embodiment of the disclosure.

Referring to FIG. 8 , the display 900, according to one of variousembodiments, may include a display panel 901, a touch sensor 902. Apixel layer 950 including a plurality of pixels 951, 952. The displaypanel 901 may include a substrate 910.

The substrate 910 may include a first substrate 910 a, a secondsubstrate 910 b, and a third substrate 910 c.

The first substrate 910 a may be disposed under the pixel layer 950.

The second substrate 910 b may be disposed at a first side of the firstsubstrate 910 a and may disposed on a second area 912 extending out ofthe pixel layer 950 from the first side of the first area 911 in whichthe pixel layer 950 is disposed, and at least a partial area of thesecond area 912 may being bendable.

The third substrate 910 c may be disposed at a second side of the firstsubstrate 910 a and may disposed on a third area 913 extending out ofthe pixel layer 950 from the second side of the first area 911 in whichthe pixel layer 950 is disposed, and at least a partial area of thethird area 913 may being bendable.

The second area 912 and the third area 913 may extend and bend from thefirst side and the second side of the first area 911, respectively.

The second substrate 910 b disposed on the second area 912 may includeat least one first wiring 920 and at least one second wiring 930.

The at least one first wiring 920 may be electrically connected with theplurality of pixels 951, 952 and may be disposed on the first area 911and the second area 912.

The at least one second wiring 930 may be electrically connected withthe at least one first wiring 920 on the second area 912.

A wiring layer 940 may be disposed between the at least one first wiring920 and the at least one second wiring 930 to be able to separate the atleast one first wiring 920 and the at least second wiring 930.

The wiring layer 940 may include a first insulating layer 941 and asecond insulating layer 942. The first insulating layer 941 may bedisposed on the first area 911, and the second insulating layer 942 maybe disposed on the second area 912. The second insulating layer 942 mayseparate the first at least one wiring 920 and the at least one secondwiring 930 at least in a bending region of the second area 912. Thepixel layer 950 may be disposed in the first insulating layer 941.

According to an embodiment, the second substrate 910 b and the thirdsubstrate 910 c may be formed in the COP structure, which is a bendablestructure. For example, the second substrate 910 b and third substrate910 c may have an elliptical or semicircular cross-section. A displaydriver 980 (e.g., a DDI) for controlling the plurality of pixels 951,952 may be disposed at an end of the second substrate 910 b. The displaydriver 980 may be electrically connected with the plurality of pixels951, 952 disposed on the first substrate 910 a through the first wiring920 and the second wiring 930. For example, in an embodiment, thedisplay driver 980 may be set to provide display information bycontrolling the pixels 951, 952 disposed on the first substrate 910 a.

According to an embodiment, the touch sensor 902 may be disposed on thetop of the first insulating layer 941 and may be disposed on the firstarea 911. The touch sensor 902 may include a plurality of electrodes(not shown). At least one wiring 961 electrically connected with theplurality of electrodes of the touch sensor 902 may be disposed on thethird area 913.

According to an embodiment, the display 901 may further include at leastone protective film 970. The at least one protective film 970 may beattached to the lower portion of the first substrate 910 a or to an endof the second substrate 910 b.

According to an embodiment, a T-IC 981 for controlling the touch sensor902 may be disposed at an end of the at least one wiring 961. The T-IC981 may be electrically connected with the plurality of electrodes ofthe touch sensor 902 through the at least one wiring 961. For example, aplurality of first electrodes and second electrodes of the touch sensor902 can generate electrical signals through a touch input on a window(not shown) of an electronic device (e.g., 101 in FIG. 1 ). Theelectrical signals generated by the plurality of first electrodes andsecond electrodes of the touch sensor 902 can be sensed through the T-IC(e.g., 981 in FIG. 981 ). The T-IC (981 in FIG. 981 ) can transmit thesensed signals to a processor (e.g., 120 in FIG. 1 ) of an electronicdevice (e.g., 101 in FIG. 1 ) and the processor (e.g., 120 in FIG. 1 )can display the sensed signals through the display 900.

As described above, the second substrate 910 b or the third substrate910 c may be disposed on a second area 912 or a third area 913,respectively. The touch sensor 902 disposed on the top of the firstinsulating layer 941 may be disposed in the first area 911, and at theleast one wiring 961 electrically connected with the plurality ofelectrodes of the touch sensor 902 may be disposed in the third area913.

According to an embodiment, since the at least one first wiring 920 andthe at least one second wiring 930 may be separately and doubly disposedin the second area (e.g., a bending region) of the second substrate 910b, it is possible to mitigate a problem (e.g., insulator cracks orbreakage of wire) that may occur due to interference between a window(not shown) of an electronic device (e.g., 101 in FIG. 1 ) and thesecond area (e.g., the bending region) of the second substrate 910 b andto reduce the width of the second area (e.g., the bending region) of thesecond substrate 910 b. Since the at least one wiring 961 of the touchsensor 902 is disposed in the third area 913, it is possible to mitigateinterference between a window (not shown) of an electronic device (e.g.,101 in FIG. 1 ) and the third area 913 (e.g., a bending region) and toreduce the width of the third area 913 (e.g., the bending region).

FIG. 9 is a lateral cross-sectional view showing a display 1000according to an embodiment of the disclosure.

Referring to FIG. 9 , the display 1000, according to one of variousembodiments, may include a display panel 1001, a touch sensor 1002, anda pixel layer 1050 including a plurality of pixels 1051, 1052. Thedisplay panel 1001 may include a substrate 1010.

The substrate 1010 may include a first substrate 1010 a, a secondsubstrate 1010 b, and a third substrate 1010 c.

The pixel layer 1050 may be disposed over the first substrate 1010 a.

The second substrate 1010 b may be disposed at a first side of the firstsubstrate 1010 a and may include a second area 1012 extending out of thepixel layer 1050 from the first side of the first area 1011 on which thepixel layer 1050 is disposed, and at least a partial area of the secondarea 1012 may being bendable.

The third substrate 1010 c may be disposed at a second side of the firstsubstrate 1010 a and may include a third area 1013 extending out of thepixel layer 1050 from the second side of the first area 1011 on whichthe pixel layer 1050 is disposed, and at least a partial area of thethird area 1013 may being bendable.

The second area 1012 or the third area 1013 may extend and bend from thefirst side or the second side of the first area 1011, respectively. Forexample, the second area 1012 may extend from a first side of the firstarea 1011 and the third area 1013 may extend from a second side of thefirst area 1011.

The second substrate 1010 b disposed on the second area 1012 may includeat least one first wiring 1020 and at least one second wiring 1030.

The at least one first wiring 1020 may be electrically connected with atleast some pixels of the plurality of pixels 1050 a and may be extendedfrom the first side of the first area 1011 to the second area 1012.

The at least one second wiring 1030 may be electrically connected withthe at least one first wiring 1020 on the second area 1012 whileseparated with the at least one first wiring 1020 by a second insulatinglayer 1042.

At least one wiring layer 1040 may be disposed on the first area 1011,the second area 1012, and the third area 1013. The wiring layer 1040 mayinclude a first insulating layer 1041, the second insulating layer 1042,and a third insulating layer 1043. The first insulating layer 1041 maybe disposed on the first area 1011 and the second insulating layer 1042may be disposed on the second area 1012 and may separate the at leastone first wiring 1020 and the at least one second wiring 1030. The thirdinsulating layer 1043 may be disposed on the third area 1013 and mayseparate at least one third wiring 1061 and a at least one fourth wiring1062, which are to be described below. The pixel layer 1050 may bedisposed in the first insulating layer 1041.

According to an embodiment, the second substrate 1010 b and the thirdsubstrate 1010 c may be formed in the COP structure, which is a bendablestructure. For example, the bent second substrate 1010 b and thirdsubstrate 1010 c may have an elliptical or semicircular cross-section. Adisplay driver 1080 (e.g., a DDI) for controlling the display panel 1001may be disposed at an end of the second substrate 1010 b. The displaydriver 1080 (e.g., a DDI) may be electrically connected with theplurality of pixels 1051, 1052, included in the first area 1011 throughthe at least one first wiring 1020 and the at least one second wiring1030. For example, in an embodiment, the display driver 1080 may be setto provide display information by controlling the pixels 1050 a includedin the first substrate 1010 a.

According to an embodiment, a plurality of electrodes (not shown) may bedisposed on the touch sensor 1002 and may be disposed on the first area1011. The touch sensor 1002 may include the plurality of electrodes (notshown). At least a partial area of the third area 1013 may be bendable.

The second area 1012 or third area 1013 may extend and bend from thefirst side and the second side of the first area 1011, respectively.

The third area 1013 may include the at least one third wiring 1061 andthe fourth wiring 1062.

The at least third wiring 1061 may be electrically connected with theplurality of electrodes (not shown) and may be connected from the firstarea 1011 to the third area 1013.

The at least one fourth wiring 1062 may be electrically connected withthe at least one third wiring 1061 in the third area 1013.

A third insulating layer 1043 may be disposed between the at least onethird wiring 1061 and the at least one fourth wiring 1062 to be able toseparate the at least one third wiring 1061 and the at least fourthwiring 1062.

According to an embodiment, the display 1001 may further include atleast one protective film 1070. The at least one protective film 1070may be attached to the lower portion of the first substrate 1010 a or toan end of the second substrate 1010 b.

According to an embodiment, a T-IC 1081 for controlling the touch sensor1002 may be disposed at an end of at least one the third wiring 1061.The T-IC 1081 may be electrically connected with the plurality ofelectrodes (not shown) of the touch senor 1002 through the third wiring1061 and the at least one fourth wiring 1062. For example, the pluralityof electrodes (not shown) can generate electrical signals through atouch input on a window (not shown) of an electronic device (e.g., 101in FIG. 1 ). The electrical signals generated by the plurality ofelectrodes (not shown) can be sensed by the T-IC 1081 through the atleast one third wiring 1061 and the fourth wiring 1062. The T-IC 1081can transmit the sensed signals to a processor (e.g., 120 in FIG. 1 ) ofan electronic device (e.g., 101 in FIG. 1 ) and the processor (e.g., 120in FIG. 1 ) can display the sensed signals through the display 1000.

As described above, since the at least one first wiring 1020 and the atleast one second wiring 1030 may be separately and doubly disposed inthe second area 1012 (e.g., a bending region) of the second substrate1010 b, it is possible to mitigate interference between a window (notshown) of an electronic device (e.g., 101 in FIG. 1 ) and the secondarea (e.g., the bending region) of the second substrate 1010 b and toreduce the width of the second area 1012 (e.g., the bending region) ofthe second substrate 1010 b Since the at least one third wiring 1061 andthe at least one fourth wiring 1062 of the touch sensor 1002 areseparated and doubly disposed in the third area 1013 (e.g., a bendingregion), it is possible to mitigate interference between a window (notshown) of an electronic device (e.g., 101 in FIG. 1 ) and the third area1013 (e.g., the bending region) and to reduce the width of the thirdarea 1013 (e.g., the bending region).

FIG. 10 is a front view showing the pattern of a second wiring of adisplay according to an embodiment of the disclosure.

FIG. 11 is a front view showing another embodiment of the pattern of thesecond wiring of the display according to an embodiment of thedisclosure.

Referring to FIG. 10 , the pattern of a second wiring 2000 may be formedin a shape similar to the waveform of a square wave. For example, thepattern of the second wiring 2000 may be a pattern in which if a sideprotrudes, the opposite side also protrudes.

Other patterns other than the pattern described above may be applied tothe pattern of the second wiring 2000.

Referring to FIG. 11 showing another embodiment of the pattern of thesecond wiring, the pattern 2001 of the second wiring may be formed in ashape similar to the waveform of a triangle wave. For example, thepattern of the second wiring 2001 may be formed in a zigzag shape. Otherpatterns other than the pattern similar to the waveform of a trianglepattern may be applied to the pattern of the second wiring 2001.

According to various embodiments, a display may include: a pixel layerincluding a plurality of pixels; and a substrate disposed under thepixel layer and including a first area on which the pixel layer isdisposed, and a second area extending out of the pixel layer from thefirst area, at least a partial area of the second area being bendable,wherein the substrate includes: a wiring layer including at least onefirst wiring electrically connected with at least one pixel of theplurality of pixels, and disposed from the first area to the secondarea, and at least one second wiring disposed in the at least partialarea and electrically connected with the at least one first wiring inthe second area.

According to various embodiments, the wiring layer may further include afirst insulating layer and a second insulating layer, and the firstinsulating layer is disposed on the first area and the second insulatinglayer may be disposed on the second area.

According to various embodiments, the display may include one or moreinsulating layers disposed in the first area and at least one of the oneor more insulating layers may at least partially include the samematerial as the first insulating layer.

According to various embodiments, the one or more insulating layers mayinclude at least one of a TFE, a PDL, or a TFT Passivation layers.

According to various embodiments, a display may include: a display panelincluding a first area including a plurality of pixels, and a secondarea including a bendable bending region; at least one first wiringelectrically connected with at least one pixel of the plurality ofpixels, and disposed on the bending region of the second area; and atleast one second wiring electrically connected with the at least onefirst wiring in the second area, and disposed on the bending region ofthe second area.

According to various embodiments, the substrate may be attached to theat least partial area of the bending region by an adhesive.

According to various embodiments, at least a portion of the secondwiring may be wider than at least a portion of the first wiring.

According to various embodiments, a pattern of the second wiring mayinclude a shape of at least one of a waveform of a square wave or awaveform of a triangle wave.

According to various embodiments, a display may include: a pixel layerincluding a plurality of pixels; and a substrate disposed under thepixel layer, including a first area on which the plurality of pixellayers is disposed, and a second area extending out of the pixel layerfrom the first area, at least a partial area of the second area beingbendable, wherein the substrate includes: at least one first wiringelectrically connected with at least one first pixels of the pluralityof pixels, and disposed from the first area to the second area; and atleast one second wiring electrically connected with at least one secondpixels different from first pixels electrically connected with the firstwiring, and disposed from the first area to the second area.

According to various embodiments, a wiring layer may be further includedbetween the at least one first wiring and the at least one secondwiring.

According to various embodiments, the wiring layer may further include afirst insulating layer and a second insulating layer, in which the firstinsulating layer may be disposed on the first area and the secondinsulating layer may be disposed on the second area.

According to various embodiments, the at least one first wiring and theat least one second wiring may include at least one data line or atleast one scan line.

According to various embodiments, the at least one data line may includefirst and second data lines, when seen from above the display, the firstdata line may be electrically connected with pixels disposed atodd-numbered positions of the plurality of pixels, and when seen fromabove the display, the second data line may be electrically connectedwith pixel layers disposed at even-numbered positions of the pluralityof pixel layers. The at least one scan line may include first and secondscan lines, the first scan line may be electrically connected with thepixels disposed at odd-numbered positions of the plurality of pixels,and the second scan line may be electrically connected with the pixelsdisposed at even-numbered positions of the plurality of pixels.

According to various embodiments, a display includes: a substrateincluding a first area and a second area extending from the first area,at least a partial area of the second area being bendable; at least onefirst wiring disposed from the first area to the second area; at leastone second wiring disposed on the at least a partial area of the secondarea, and electrically connected with the at least one first wiring inthe second area; and at least one wiring layer disposed between the atleast one first wiring and the at least one second wiring and separatingthe at least one first wiring and the at least one second wiring.

According to various embodiments, the substrate may include at least oneof a display substrate or a touch substrate.

According to various embodiments, the at least one first wiring may bedisposed on a first surface of the at least one wiring layer and the atleast one second wiring may be disposed on a second surface opposite tothe first surface of the at least one wiring layer.

According to various embodiments, the at least one first wiring and theat least one second wiring may form double wires by being separated bythe wiring layer.

According to various embodiments, the at least one wiring layer mayfurther include a first insulating layer and a second insulating layer,and the first insulating layer may be disposed on the first area and thesecond insulating layer may be disposed on the second area.

According to various embodiments, the at least one wiring layer mayinclude a wiring extension extending from the second insulating layerand covering the display driver of the display.

According to various embodiments, the at least one first wiring mayinclude a data line or a scan line, the data line may be electricallyconnected with pixels disposed at odd-numbered positions of theplurality of pixel s, and the scan line may be electrically connectedwith pixels disposed at even-numbered positions of the plurality ofpixels.

According to various embodiments, a display may include; a substrateincluding a first area, a second area extending from a first side of thefirst area, and a third area extending from a second side of the firstarea, at least a partial area of the second area being bendable, and atleast a partial area of the third area being bendable; at least onefirst wiring disposed from the first side of the first area to thesecond area; at least one second wiring disposed on the at least apartial area of the second area, and electrically connected with the atleast one first wiring in the second area; at least one third wiringdisposed from the second side of the first area to the third area; andat least one fourth wiring disposed on the at least a partial area ofthe third area, and electrically connected with the at least thirdwiring in the third area.

According to various embodiments, a wiring layer separating the at leastone first wiring and second wiring may be included between the at leastone first wiring and the at least one second wiring.

According to various embodiments, the wiring layer may further includesa first insulating layer, a second insulating layer and a thirdinsulating layer, and the first insulating layer may be disposed on thefirst area, the second insulating layer disposed between the at leastone first wiring and the at least one second wiring and separating theat least one first wiring and the at least one second wiring is disposedon the second area, and the third insulating layer disposed between theat least one third wiring and the at least one fourth wiring andseparating the at least third and the at least one fourth wiring isdisposed on the third area.

According to various embodiments, the at least one first wiring and theat least one second wiring may be electrically connected with thedisplay driver of the display, and the at least one third wiring and theat least one fourth wiring may be electrically connected with a touchpanel display driver of the display.

According to various embodiments, a width of at least a portion of thesecond wiring may be greater than a width of at least a portion of thefirst wiring, and a width of at least a portion of the fourth wiring maybe greater than a width of at least a portion of the at least one thirdwiring.

While the disclosure has been shown and described with reference tovarious embodiments thereof, it will be understood by those skilled inthe art that various changes in form and details may be made thereinwithout departing from the spirit and scope of the disclosure as definedby the appended claims and their equivalents.

What is claimed is:
 1. A display comprising: a substrate including a first area and a second area, wherein the first area is substantially planar and the second area extends from the first area and includes a bended portion; a first insulating layer disposed over the first area; a second insulating layer disposed over the second area including the bended portion; a pixel layer disposed in the first insulating layer, the pixel layer including a plurality of pixels formed therein and including a first pixel and a second pixel; a first wiring disposed under the first insulating layer and extending from the first area to the second area, an ending portion of the first wiring electrically connected with the first pixel; and a second wiring disposed under the first insulating layer and extending from the first area to the second area, an ending portion of the second wiring electrically connected with the second pixel; and wherein a portion of the first wiring extended to the second area is disposed under the second insulating layer, and a portion of the second wiring extended to the second area is disposed over the second insulating layer.
 2. The display of claim 1, further comprising: a display driver disposed on a surface of the substrate; and wherein another ending portion of the first wiring and another ending portion of the second wiring are electrically connected with the display driver.
 3. The display of claim 1, wherein the first pixel is disposed at an odd-numbered position of the plurality of pixels included in the pixel layer, and the second pixel is disposed at an even-numbered position of the plurality of pixels.
 4. The display of claim 1, wherein the ending portion of the first wiring is disposed under the first pixel, and the ending portion of the second wiring is disposed under the second pixel.
 5. The display of claim 1, wherein at least a portion of a pattern of the second wiring includes a shape of at least one of a waveform of a square wave or a waveform of a triangle wave.
 6. The display of claim 1, wherein a width of at least a portion of the second wiring is greater than a width of at least a portion of the first wiring.
 7. The display of claim 1, wherein the substrate includes at least one of a display substrate or a touch substrate.
 8. The display of claim 1, wherein no pixel is formed in the second insulating layer.
 9. The display of claim 1, wherein at least one of the first wiring and the second wiring includes a data line or a scan line.
 10. The display of claim 9, wherein the data line is electrically connected with pixels disposed at odd-numbered positions of the plurality of pixels, and wherein the scan line is electrically connected with pixels disposed at even-numbered positions of the plurality of pixels.
 11. A portable communication device comprising: a housing; and a display accommodated in the housing, the display including: a substrate including a first area and a second area, the first area substantially planar and the second area extended from the first area and including a bended portion; a first insulating layer disposed over the first area; a second insulating layer disposed over the second area including the bended portion; a pixel layer disposed in the first insulating layer, the pixel layer including a plurality of pixels formed therein and including a first pixel and a second pixel; a first wiring disposed under the first insulating layer and extending from the first area to the second area, an ending portion of the first wiring electrically connected with the first pixel; and a second wiring disposed under the first insulating layer and extending from the first area to the second area, an ending portion of the second wiring electrically connected with the second pixel; and wherein a portion of the first wiring extended to the second area is disposed under the second insulating layer, and a portion of the second wiring extended to the second area is disposed over the second insulating layer.
 12. The portable communication device of claim 11, wherein at least one of the first wiring and the second wiring includes a data line or a scan line.
 13. The portable communication device of claim 11, further comprising: a display driver disposed on a surface of the substrate; and wherein another ending portion of the first wiring and another ending portion of the second wiring are electrically connected with the display driver.
 14. The portable communication device of claim 11, wherein the first pixel is disposed at an odd-numbered position of the plurality of pixels included in the pixel layer, and the second pixel is disposed at an even-numbered position of the plurality of pixels.
 15. The portable communication device of claim 11, wherein the ending portion of the first wiring is disposed under the first pixel, and the ending portion of the second wiring is disposed under the second pixel.
 16. The portable communication device of claim 11, wherein at least a portion of a pattern of the second wiring includes a shape of at least one of a waveform of a square wave or a waveform of a triangle wave.
 17. The portable communication device of claim 11, wherein a width of at least a portion of the second wiring is greater than a width of at least a portion of the first wiring.
 18. The portable communication device of claim 12, wherein the data line is electrically connected with pixels disposed at odd-numbered positions of the plurality of pixels, and wherein the scan line is electrically connected with pixels disposed at even-numbered positions of the plurality of pixels.
 19. The portable communication device of claim 11, wherein the substrate includes at least one of a display substrate or a touch substrate.
 20. The portable communication device of claim 11, wherein no pixel is formed in the second insulating layer. 